Boundary Element Method For Solving The Heat Flow In Resistive Switching Devices With Different Thermal Conductivity

dc.contributor.advisorTamirat Temesgen (PhD)
dc.contributor.authorAbduljabar Ibrahim
dc.date.accessioned2025-12-16T13:46:45Z
dc.date.issued2020-08-10
dc.description.abstractIn thisthesis wesolved theheat equation inresistive switchingdevices usingboundary element method. Inthismethodtheheatequationwiththeboundaryconditionconvertedintotheboundary integral equation by applying the Green’s second identity and using fundamental solution. Then, the boundary of the domain was divided into finite small boundary elements. By adding up the integral over each element, the BIE is discretized into system of linear equation. Then we solved this system of equation to obtain, both the temperature and the normal derivative of the temperature(flux) distribution on the boundary of the device. Finally, we used this boundaryvaluesinboundaryintegralequationtodeterminethetemperaturedistributionatanypoint inside the domain.en_US
dc.description.sponsorshipASTUen_US
dc.identifier.urihttp://10.240.1.28:4000/handle/123456789/481
dc.language.isoenen_US
dc.publisherASTUen_US
dc.subjectFundamentalsolution,Green’sformula,Boundaryintegralrepresentation,Boundary integral equation, Boundary element method, Resistive switching device.en_US
dc.titleBoundary Element Method For Solving The Heat Flow In Resistive Switching Devices With Different Thermal Conductivityen_US
dc.typeThesisen_US

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